News
📚Inspiring the next generation of engineers and innovators!
As part of the COIN-3D Project, we had the pleasure of visiting the 2nd Model High School of Volos, where we introduced students to the fascinating world of microelectronics, chip design, and the technologies that power modern computing systems[…]
June 11, 2026
✈️Research Visits to the University of Bremen!
As part of the COIN-3D project, several researchers from the University of Thessaly recently visited the University of Bremen, strengthening collaboration with our partner institution and advancing research on reliable next-generation integrated systems[…]
May 29, 2026
📢The 3rd Advanced Course of the COIN-3D
The 3rd Advanced Course of the COIN-3D Project has successfully concluded!
Over the past days, we had the pleasure of hosting “Integration of EDA Tools into Chiplet Design and Verification”, bringing together researchers[…]
May 25, 2026
💡COIN3D at DATE 2026
What a fantastic experience at Design, Automation and Test in Europe Conference (DATE) 2026! 🚀
We were delighted to represent the hashtag#COIN3D_EU project during the Multi-Partner[…]
May 20, 2026
💡COIN-3D & TWINRELECT Joint Event at University of Thessaly
We would like to sincerely thank everyone who attended our joint event with TWINRELECT at the University of Thessaly in Volos. 🙌
During the event, we had the opportunity to present the research activities of [..]
May 10, 2026
💡PRAXI Network webinar
At the PRAXI Network webinar on Twinning, Dr. George Floros presented the COIN-3D Project […]
April 1, 2026
📢The 2nd Advanced Course of the COIN-3D
The 2nd Advanced Course of the COIN-3D Project has successfully concluded!
Over the past days, we had the pleasure of hosting “Advanced Techniques in EDA Tool Development for Chiplet Reliability”, bringing together researchers[…]
December 21, 2025
🚀ICCD 2025 CONFERENCE
COIN3D PhD candidates Maria Pantazi and George Gkountroumanis travelled to Dallas for ICCD 2025. George took the stage to present our work, “3DPX – An Open-Source Methodology for 3D Physical Design Exploration”[…]
December 02, 2025
🌟Research Exchanges at the UvA
From October 12 to October 22, three PhD candidates from the COIN-3D project visited the University of Amsterdam (UvA) for a research exchange with the Parallel Computing Systems (PCS) group […]
November 28, 2025
📢 Talk Highlight from the COIN-3D Network!
We are excited to announce the COIN-3D Summer SLast week, we had the pleasure of featuring Dr. Anuj Pathania (Assistant Professor, University of Amsterdam) who delivered an engaging talk titled: “Edge Inference on HMPSOCs” […]
November 11, 2025
📢 Save the Date – COIN-3D Summer School 2025!
We are excited to announce the COIN-3D Summer School, taking place 22–26 September 2025 at the ECE Building, University of Thessaly, Volos, Greece.
August 28, 2025
🚀 European Innovation in Chip Design: UTH at the Forefront
🏛️ The University of Thessaly is leading two groundbreaking European projects, driving advancements in 🔬 chip design, 🤖 AI applications, and reliability research. These initiatives highlight UTH’s pivotal role in shaping next-generation […]
August 25, 2025
🎓 Empowering the Next Generation of Researchers! 🎓
During IEEE ICDCS 2025 in Glasgow, the COIN-3D project participated in the Doctoral Consortium — a dedicated forum for early-stage researchers to share their work […]
August 9, 2025
🌟 A heartfelt thank you to everyone who joined us at the 1st HiPER-3D Workshop!
Organized by the COIN-3D Project, the workshop showcased exciting advances in 3D chiplet technologies, with insightful talks and discussions throughout the day […]
August 5, 2025
🎯 Diving into Research Management at University of Glasgow!
A great day with the team attending a talk on research management at the University of Glasgow’s Computer Science Department! It was refreshing to step back from […]
July 26, 2025
📢 Open Innovation Seminar!
💡 Ready to rethink how innovation happens?
Don’t miss the Open Innovation Seminar!
June 9, 2025
🚀 The 2nd COIN-3D Newsletter is out!
Catch up on project highlights, research updates, and recent events — including our Advanced Course, second webinar, and latest publications on 3D chiplet reliability.
May 31. 2025
🌟First COIN-3D Advanced Course!
🎉 What a blast!
Thank you all for making last week’s Advanced Course on EDA Tools for 2.5/3D Chiplet Reliability such a success! Your enthusiasm — both online and on-site — truly brought this event to life. […]
May 5, 2025
📢 Advanced Course on EDA Tools for 2.5/3D Chiplet Reliability!
🚀 Kicking off soon: Advanced Course on EDA Tools for 2.5/3D Chiplet Reliability!
We’re thrilled to announce our upcoming Advanced Course:
🎓 Foundations of EDA Tools in 2.5/3D Chiplet Reliability […]
April 11, 2025
🌟 Second COIN-3D Webinar! 🌟
🌟 Thank You for Joining the Second COIN-3D Webinar! 🌟
We’re excited to share the success of our second webinar, “Custom Tool Development Strategies for Chiplet Reliability”, held as part of the COIN-3D Horizon Europe Twinning project! 🚀
A big thank you to our outstanding speakers for their engaging […]
April 7, 2025
📢Join Our 2nd Webinar!
📅 28th March 2025 | 12:00 – 13:15 CET
Join us for the second webinar of our Horizon Europe Twinning project, COIN-3D: Collaborative Innovation in 3D VLSI Reliability!
🌟 Webinar Topic: Custom Tool Development Strategies for Chiplet Reliability […]
March 20, 2025
🌟 First COIN-3D Webinar! 🌟
We are delighted to share the success of our first COIN-3D webinar, “Machine Learning Applications in EDA for Chiplet Reliability.” As part of the COIN-3D Horizon Europe Twinning project, this event explored how AI is transforming chip design […]
March 13, 2025
🌟 HiPER-3D
We are thrilled to announce our involvement in the 1st Workshop on High Performance and Energy Efficient Architectures for 3D Chiplets (HiPER-3D), which will take place alongside the 45th IEEE International Conference on Distributed Computing Systems (ICDCS 2025) in Glasgow, Scotland, from 20-23 July 2025. 🌍 […]
January 21, 2025
📢Join Our 1st Webinar!
📅 31st January 2025 | 12:00 – 13:10 CET
We are thrilled to announce our upcoming webinar, where we explore how AI is revolutionizing chip design and testing.
🌟 Webinar Topic: Machine Learning Applications in EDA for Chiplet Reliability […]
January 7, 2025
Kick-Off Meeting
We are pleased to announce the kickoff of COIN-3D: Collaborative Innovation in 3D VLSI Reliability, which took place on Monday, September 26th 2024 in Volos, Greece. The initiative is coordinated by University of Thessaly in collaboration with […]
September 30, 2024
