About  COIN – 3D

COIN-3D is a Horizon Europe Twinning Bottom Up action designed to build research capacity at the University of Thessaly (UTH). The project aims to establish strong collaborations with top European research institutions and creates opportunities for knowledge exchange in advanced VLSI systems. By developing tailored training programs and focusing on Electronic Design Automation (EDA) tools for reliability assessments, COIN-3D aims to push the frontiers of 2.5/3D chiplet architectures. The project contributes to long-term innovation and positions UTH as a key player in the semiconductor research community, aligned with the goals of the European Chips Act.

Action Duration: September 1, 2024 – August 31, 2027 (3 years)
EU Funding Scheme: Twinning Bottom-Up (HORIZON-WIDERA-2023-ACCESS-02)
Partners: UTH, UGLA, UvA, UBREMEN
Total Budget: 1.2 M EUR (EU contribution)