Over the past days, we had the pleasure of hosting the 3rd Advanced Course “Advanced Techniques in EDA Tool Development for Chiplet Reliability”, bringing together researchers, students, engineers, and professionals to explore the latest advances in 2.5D/3D chiplet technologies, advanced EDA methodologies, and chiplet reliability.

📌 The course featured:
• Expert lectures
• Hands-on workshops
• Technical discussions
• Networking opportunities
• In-depth sessions on next-generation chiplet reliability and EDA tools

A big thank you to all the speakers, participants, and contributors for the engaging discussions, insightful presentations, and collaborative spirit throughout the course.
We would also like to thank everyone who supported the organization of the event and helped make the 3rd Advanced Course a successful and enjoyable experience.

Stay tuned for more upcoming COIN3D activities and events! 👀