General Objective
The project aims to boost research and innovation capacity of University of Thessaly by fostering strategic networking and knowledge exchange with leading European institutions. It focuses on enhancing research management and commercialization, particularly in advanced VLSI design and 2.5/3D chiplet architectures, aligning with broader EU initiatives like the European Chips Act.
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Coordination and support activities
Conference and workshops
Organisation of ≥2 panel discussions and special session.
Visiting Researcher program
≥25 outward and ≥8 inward short visits.
Training programmes
≥3 summer schools, ≥3 webinars, and ≥3 advanced training courses.
Early-stage researchers
Bring together early-stage researchers in ≥2 joint forum events.
Administrative staff and ttos
Assist reasearchers in traslating research outcomes into commercial ventures.
Network and Collaboration opportunities
Foster collaboration knowledge exchange.
Project Details
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This project has received funding from the European Union’s Horizon research and innovation programme under grant agreement No. 101159667.
The content of this website reflects the COIN 3D consortium view and the European Commission is not responsible for any use that may be made of the information it contains.
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Latest News
June 11, 2026
📚Inspiring the next generation of engineers and innovators!
As part of the COIN-3D Project, we had the pleasure of visiting the 2nd Model High School of Volos, […]
May 29, 2026
✈️Research Visits to the University of Bremen!
As part of the COIN-3D project, several researchers from the University of Thessaly recently visited the University of Bremen, […]
May 25, 2026
📢The 3rd Advanced Course of the COIN-3D
The 3rd Advanced Course of the COIN-3D Project has successfully concluded! Over the past days, we had the pleasure […]
