We are delighted to share the success of our first COIN-3D webinar, “Machine Learning Applications in EDA for Chiplet Reliability.” As part of the COIN-3D Horizon Europe Twinning project, this event explored how AI is transforming chip design and enhancing semiconductor reliability. Leading researchers shared their insights on the latest advancements in the field, offering valuable discussions among attendees.

A Special Thank You to Our Speakers:
🔹 Dr. George Floros
🔹 Dr. Tahani Aladwani
🔹 Dr. Yixian Shen
🔹 Dr. Olympia Axelou

🔍 Some of the key topics discussed in the webinar:
✅ ML/DL/AI Introduction
✅ Thermal Challenges in EDA
✅ Lithographic Hotspots Detection
✅ BeGAN
✅ ML-assisted Approach for Accelerated Thermal & IR Drop Analysis
✅ Swarm Intelligence
✅ Unified Thermal Scheduler for DNN in 3D-stacked Systems

🎥 Full webinar here: https://www.youtube.com/watch?v=aPm2kv7R4HI
📺 Individual session playlist here: https://www.youtube.com/playlist?list=PLHt0747KTR9xNmKb-U41r5wZPH6nn-nnK

This webinar was organized in collaboration with:
🏛 University of Thessaly
🏛 University of Amsterdam
🏛 University of Bremen
🏛 University of Glasgow

👏 We truly appreciate everyone who attended, engaged with insightful questions, and contributed to the discussions. Your participation made this event a success!