🌟 Thank You for Joining the Second COIN-3D Webinar! 🌟

We’re excited to share the success of our second webinar, “Custom Tool Development Strategies for Chiplet Reliability”, held as part of the COIN-3D Horizon Europe Twinning project! 🚀

A big thank you to our outstanding speakers for their engaging presentations and valuable insights:
🔹 Dr. George Floros
🔹 Dr. Anuj Pathania
🔹 Dr. Alberto Garcia-Ortiz
🔹 Dr. Olympia Axelou

👏 We’re grateful to everyone who attended, asked thoughtful questions, and helped spark important conversations in the chiplet design and reliability community!

🎥 Watch the full webinar: https://www.youtube.com/watch?v=l5PPIBXDP6o
📺 Explore all sessions in the playlist: https://www.youtube.com/playlist?list=PLHt0747KTR9xpo-jSFxIFobifLC3cQqeJ

📌 COIN-3D is proudly co-funded by the European Union and unites:
🏛️ University of Thessaly
🏛️ University of Amsterdam
🏛️ University of Bremen
🏛️ University of Glasgow

🔍 More events and updates are on the way—stay tuned for the next steps in collaborative innovation for 2.5D/3D VLSI reliability!