🌟 A heartfelt thank you to everyone who joined us at the 1st HiPER-3D Workshop — High Performance and Energy Efficient Architectures for 3D Chiplets — held as part of IEEE ICDCS 2025 in Glasgow!

Organized by the COIN-3D Project, the workshop showcased exciting advances in 3D chiplet technologies, with insightful talks and discussions throughout the day.

🙏 A special thanks to our presenters for their excellent contributions:
🎤 Maria Pantazi – “A System-Level Aware Power Delivery Network Generator for Multiprocessor Systems”
🎤 George Goudroumanis – “Design Space Exploration based on Q-Learning for 2D Bin-packing Problems”
🎤 Pavlos Stoikos – “Matrix Exponential-Based Thermal Simulation for Distributed Computing Infrastructures”
🎤 Pelopidas Tsoumanis – “TCAD Simulation of Radiation Effects in 3D-Stacked Semiconductor Devices”
🎤 Wenhao Li – “Decentralized Deep Learning for Lithographic Hotspot Detection in IC Design”
and 🎤 George Floros – “Towards EMIR Mitigation: Efficient Wire Sizing for VLSI Power Grids Based on L-BFGS Algorithm”