We are thrilled to announce our involvement in the 1st Workshop on High Performance and Energy Efficient Architectures for 3D Chiplets (HiPER-3D), which will take place alongside the 45th IEEE International Conference on Distributed Computing Systems (ICDCS 2025) in Glasgow, Scotland, from 20-23 July 2025. 🌍
Follow our journey and stay updated!

HiPER-3D is an exciting opportunity for researchers, engineers, and industry professionals to engage in discussions about groundbreaking advancements in 3D chiplet technologies, with a focus on high performance and energy efficiency. This workshop aims to foster collaboration and share innovative ideas that push the boundaries of next-generation chiplet architectures.

🔍 Topics of Interest
– High-performance design methodologies for 3D chiplets
– Energy-efficient computing and thermal management strategies
– Architectures and tools for 3D chiplet integration
– Reliability and fault-tolerance in 3D chiplets
– Applications of AI/ML for EDA
– Emerging trends and tools in chiplet design workflows

📅 Important Dates
– Submission Deadline: 15 March 2025
– Notification of Acceptance: 2 April 2025
– Camera-Ready Deadline: 16 April 2025
– Workshop Date: 20 July 2025

🔗 For more details and submission guidelines, https://lnkd.in/dXXqii_p

We are proud to organize this workshop as part of the COIN-3D project and to contribute to shaping the future of 3D chiplet technologies. All accepted and presented papers will be included in the IEEE ICDCSW companion conference proceedings and the IEEE digital library. We warmly invite you to submit your papers and join us in this exciting event!