We are pleased to announce the kickoff of COIN-3D: Collaborative Innovation in 3D VLSI Reliability, which took place on Monday, September 26th 2024 in Volos, Greece.
The initiative is coordinated by University of Thessaly in collaboration with top-level European academic institutions University of Amsterdam, University of Bremen, and University of Glasgow.
This project brings together expertise from across the field to address key challenges in 3D VLSI and microelectronics, with the goal of driving innovation in next-generation semiconductor solutions. Looking forward to the great work ahead as we make progress toward a future of reliable, cutting-edge technology.
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