News

📢 The 2nd Advanced Course of the COIN-3D Project has successfully concluded! 🚀


Over the past days, we had the pleasure of hosting “Advanced Techniques in EDA Tool Development for Chiplet Reliability”, bringing together researchers, engineers, and practitioners to explore cutting-edge topics in 2.5D/3D chiplet technologies, advanced EDA tooling, and reliability methodologies.

📌 The course featured:
• Expert lectures
• Hands-on workshops
• Special events
• In-depth discussions on next-generation chiplet reliability tools

A big thank you to all the speakers and participants for the engaging discussions, insightful questions, and collaborative spirit throughout the course. It was great to see such strong interest and interaction from the community.